Two components adhesive thermoconductive

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Two-component thermal bonding system and loads of metal oxide.
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Availability: In stock

Excl. Tax: €30.00 Incl. Tax: €36.60
1 available in ready-to-dispatch, upper quantity available in 2/4 days

Product Description


System thermally bonded to metal oxide components on printed circuit boards and heat sinks. Two-component thermal bonding system and loads of metal oxide Can be used to secure heat sinks and as a means of attachment for surface mounting devices High tensile Excellent thermal conductivity High electrical insulation properties The system, solvent-free ensures no contact between the overlapping surfaces, avoiding any risk of electrical leakage Extremely thin layer (about 200μ) Can be used to paste a wide range of surfaces, dissimilar metals, epoxy, acrylics, polycarbonates, etc.. Outlet temperature Mixing ratio of 3 to 1 Electrical resistance: 11 to 12kV/mm Volume resistivity: from 1014 to 1015Ω/cm Capacity specific heat resin: from 0.5 cal / g / ° C to 30 ° C Hardener: from 0.35 cal / g / ° C to 30 ° C ° Shelf life once mixed: 3 to 4 hours Setting time: 8 to 12 hours at room temperature environment (resistant) 48 hours at room temperature (Taken full) 45 minutes at 100 ° C

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