Two components adhesive thermoconductive

Be the first to review this product

Two-component thermal bonding system and loads of metal oxide.
Continue >>

Availability: In stock

Excl. Tax: €30.00 Incl. Tax: €36.60

Product Description


System thermally bonded to metal oxide components on printed circuit boards and heat sinks. Two-component thermal bonding system and loads of metal oxide Can be used to secure heat sinks and as a means of attachment for surface mounting devices High tensile Excellent thermal conductivity High electrical insulation properties The system, solvent-free ensures no contact between the overlapping surfaces, avoiding any risk of electrical leakage Extremely thin layer (about 200μ) Can be used to paste a wide range of surfaces, dissimilar metals, epoxy, acrylics, polycarbonates, etc.. Outlet temperature Mixing ratio of 3 to 1 Electrical resistance: 11 to 12kV/mm Volume resistivity: from 1014 to 1015Ω/cm Capacity specific heat resin: from 0.5 cal / g / ° C to 30 ° C Hardener: from 0.35 cal / g / ° C to 30 ° C ° Shelf life once mixed: 3 to 4 hours Setting time: 8 to 12 hours at room temperature environment (resistant) 48 hours at room temperature (Taken full) 45 minutes at 100 ° C

Additional Information

Additional Information



Write Your Own Review

You're reviewing: Two components adhesive thermoconductive

Product Tags

Product Tags

Use spaces to separate tags. Use single quotes (') for phrases.

Unauthorized reproduction is prohibited for all content (images, texts, documentation, etc ...) of this site as property of :
Global Engineering Network srl
Sede legale : Piazzetta alla Posta 13 - 31022 Preganziol (TV) - Italy | Sede Operativa : Via A. Volta 23 - 31030 Dosson di Casier (TV) - Italy
C.F. e P.IVA: 04147150264 | CCIAA: 5646893 | REA: 326590